Summary of application patents related to the etching gas HFC-41
Introduction
APPLICANT |
PATENT NAME |
United microelectronics corp.(TW) |
Semiconductor device having spacer with tapered profile |
APPLIED MATERIALS INC [US] |
Dielectric etch method with high source and low bombardment plasma providing high etch rates |
UNITED MICROELECTRONICS CORP |
Semiconductor device and method for fabricating the same |
TOKYO ELECTRON LTD |
Exhaust gas explosion prevention method for reduced pressure processing device |
HITACHI HIGH TECH CORP |
Dry etching method |
LAM RES CORP |
Line edge roughness control |
PROMOS TECHNOLOGIES INC |
Method of etching capable of avoiding loading effect and controlling the thickness of screen oxide |
CENTRAL GLASS CO LTD [JP] |
Etching Gas |
TOKYO ELECTRON LTD |
PLASMA TREATMENT METHOD AND PLASMA TREATMENT DEVICE |
FUJITSU SEMICONDUCTOR LTD [JP] |
Method of etching silicon nitride by a mixture of CH2F2, CH3F or CHF3 and an inert gas |
CENTRAL GLASS CO LTD [JP] |
Cleaning Gas |
SEMICONDUCTOR MFG INT SHANGHAI |
Semiconductor device used in interconnection technology and manufacturing method thereof |
ADVANCED TECH MATERIALS [US] |
Cleaning of semiconductor processing systems |
TAIWAN SEMICONDUCTOR MFG |
Method for forming a tapered profile insulator shape |
SAMSUNG ELECTRONICS CO LTD |
Composition for a wiring, a wiring using the composition, a manufacturing method thereof, a display using the wiring and a manufacturing method thereof |